China International Bidding Network disclosed on Monday (6th) that Yangtze Memory Technologies released the 40th and 41st batches of international bidding announcements, with bidding products including titanium chemical vapor deposition - titanium nitride atomic layer deposition equipment, thick silicon nitride vertical low-pressure chemical vapor deposition equipment, vertical ultra-high temperature annealing equipment, etc.

　　According to a report by Dongwu Securities analyst Chen Xianfan on the 6th, the 41st batch of bidding also includes packaging-level high-parallelism chip sorting machines, high-speed chip testing machines, and other products.

　　It is worth noting that, according to a previous report by the Science and Technology Innovation Board Daily, on the 20th of last month, the second phase of the national memory base project implemented by Yangtze Memory Technologies recently started construction in the Wuhan East Lake High-tech Zone, with a planned production capacity of 200,000 wafers per month. After reaching full production, the total monthly production capacity will reach 300,000 wafers combined with the first phase project.

　　In addition, Yangtze Memory Technologies officially announced in April this year that the 128-layer QLC 3D NAND has been successfully developed and verified by multiple customers, directly entering 128 layers from 64 layers, skipping 72/96 layers.

　　In recent years, Yangtze Memory Technologies has gradually released orders to domestic semiconductor equipment manufacturers. According to Dongwu Securities' report by Chen Xianfan on the 6th, as of early July, Yangtze Memory Technologies has cumulatively released 2,048 sets of process equipment, including 290 sets of domestic equipment, with a localization rate of 14%.

　　Among them, Northern Huachuang won bids for 3 etching equipment, 3 film deposition equipment, and 4 annealing equipment, with corresponding field shares of 6%, 5%, and 18%; Zhongwei Semiconductor won bids for 9 etching equipment, accounting for 19%; Huahai Qingke won bids for 6 CMP equipment, accounting for 18%; Jingce Electronics won bids for 3 testing equipment, accounting for 13%.

　　Chen Xianfan from Dongwu Securities pointed out that compared to other production lines, Yangtze Memory Technologies has a higher bid-winning rate among domestic manufacturers, and the intensive bidding by Yangtze Memory Technologies is expected to accelerate the increase in the localization rate.

　　In addition, according to a report analysis by Guangfa Securities analyst Xu Xingjun on June 21, by 2022, due to more mature technology reserves and mass production ramp-up, the capacity ramp-up of the national memory base project phase two is also expected to continue to exceed expectations. Therefore, overall, the capacity expansion and capital expenditure of Yangtze Memory Technologies are showing an accelerated state.

　　Xu Xingjun believes that, on the one hand, the market size of semiconductor equipment is highly synchronized with the capital expenditure of downstream wafer fabs; on the other hand, Yangtze Memory Technologies is an important production line in China, with a strong willingness to introduce domestic equipment, especially in the later stages when technology is more mature and production capacity is larger, the share of domestic equipment is expected to further increase.

　　Domestic companies that have established a presence in the semiconductor equipment sector include: Zhongwei Company (the leading domestic etching equipment manufacturer entering the global supply chain); Northern Huachuang (the leading manufacturer of wafer equipment with a diversified business portfolio); Shengmei Co., Ltd. (the leading domestic cleaning equipment manufacturer, soon to be listed on the Science and Technology Innovation Board); Jingsheng Electromechanical (the leading manufacturer of large silicon wafer equipment).