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Anhui Botai Company successfully won the bid for the key areas of manufacturing in Anhui Province in 2021, focusing on the collaborative research and development of products and key common technologies to address shortcomings.
Release time:
2022-01-06
Anhui Botai Company successfully announced the key tasks for tackling the shortcomings in the application of products and key common technologies in the manufacturing industry in Anhui Province for 2021.
Currently, the "high dielectric constant (high-K) thin film precursor materials for chip manufacturing" declared by Anhui Botai Company has successfully announced the key tasks for tackling the shortcomings in the application of products and key common technologies in the manufacturing industry in Anhui Province for 2021, marking a significant progress made by Anhui Botai Company in the research and application of advanced electronic materials for semiconductors.
2021In November of the year, the Anhui Provincial Department of Economy and Information Technology released the "Announcement Work Plan for Tackling the Shortcomings in the Application of Products and Key Common Technologies in Key Areas of Manufacturing Industry," in which the "high dielectric constant (high-K) thin film precursor materials for chip manufacturing" is one of the announced projects. After receiving the relevant documents, Anhui Botai, as the leading unit, joined forces with Anhui University of Technology as the second declaring unit to form a project R&D team to analyze and demonstrate the announced tasks, quickly forming the application materials, which ultimately passed the relevant review and online public announcement, successfully announcing the project tackling tasks.
According to the project implementation plan, Anhui Botai will take three years to develop and research the high dielectric constant (high-K) thin film precursor materials TEMAZr, TEMAHf, TDMAHf, CpZr, CpHf, HfCl.4Synthesis technology, separation and purification technology, analysis and detection methods, industrial design, and solid packaging containers will be developed to achieve the demonstration application of products in advanced process technology, enhance the development level of advanced electronic materials, and support breakthroughs in advanced manufacturing processes for integrated circuits. During the project implementation process, work will be carried out simultaneously to apply for invention patents, formulate industry standards, and cultivate professional talents.
High-purity electronic materials TEMAZr, TEMAHf, TDMAHf, CpZr, CpHf, and HfCl.4Due to their unique thin film deposition characteristics, they are widely used in advanced process technology for integrated circuits, suitable for DRAM, 3D NAND, and Logic 300mm wafer production lines. The aforementioned products will solve the core material localization issues in the domestic semiconductor industry, break foreign technology blockades, fill domestic gaps, and provide important guarantees for the preparation, purification, and industrialization technology of new materials supporting the national integrated circuit industry, promoting the healthy development of China's integrated circuit industry.
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