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A new type of electronic materials company that is based on independent research and development, integrating development, production, sales, and service.
22
2020-12
Recently, the globally renowned business information service provider IHS Markit, after in-depth analysis, predicts that the new installed capacity of photovoltaics in 2021 will reach 158GW.
2020-12-22
22
2020-12
The back surface passivation technology of photovoltaic cells has become a new favorite.
In management, there is a saying that an ice cream vendor who can survive selling ice cream in winter can survive at any time. The cold winter is the hardest time, the most painful time, and also the time for various enterprises to self-adjust, accumulate strength, and cultivate strong genes.
2020-12-22
22
2020-12
Although the solar photovoltaic market is currently in a low period, it is also seen as a golden period for technological research and development. Recently, one of the technical focuses of concern for businesses on both sides of the Taiwan Strait is the backside passivation technology and equipment that many international equipment manufacturers have planned to launch over the past year. This technology not only allows the module end to inherit the current welding technology but is also expected to increase efficiency by 0.2 to 0.5 percentage points. However, equipment manufacturers are not rushing to launch it, considering the production yield and cost optimization on the client side.
2020-12-22
22
2020-12
Yangtze Memory Technologies released the 40th and 41st batches of international bidding announcements, with the bidding products including titanium chemical vapor deposition - titanium nitride atomic layer deposition equipment, thick silicon nitride vertical low-pressure chemical vapor deposition equipment, vertical ultra-high temperature annealing equipment, etc.
2020-12-22
22
2020-12
Since 2010, the global solar photovoltaic industry has entered a period of rapid development, with the annual installed capacity of solar photovoltaics growing quickly, and the upstream thin-film equipment industry also developing rapidly. The broad market prospects have attracted many companies to enter the layout, including Weidao Nano, which was established in 2015.
2020-12-22
04
2020-12
Under the guidance of Moore's Law, the line width of integrated circuits continues to shrink, basically progressing at a pace of reducing to 70% of the original size every two years. For example, it reached 45nm in 2007, 32nm in 2009, and 22nm in 2011. The 28nm process is situated between 32nm and 22nm, and the industry introduced the second generation of high-k dielectric/metal gate process at 32nm based on the earlier 45nm (HKMG) process, laying the foundation for the gradual maturity of 28nm. The year 2013 marked the popularization of the 28nm process, and between 2015 and 2016, the 28nm process began to be widely used in Mobile application processors and basebands. The limit of planar design on wafers can achieve optimized costs at 28nm. In contrast, the subsequent 16/14nm processes require the introduction of FinFET technology, which will increase wafer manufacturing costs by at least 50%. Only applications with a large volume, such as Mobile, can share the costs. In many non-consumer-related applications, the stability of the 28nm process, as well as its performance and cost parameters, are very cost-effective.
2020-12-04
16
2020-09
Transistor selection after 1nm: CFET?
At VLSI 2020, IMEC published an interesting paper on monolithic CFET, and I had the opportunity to interview one of the authors, Airoura Hiroaki. It is well known in the industry that FinFET (FF) is approaching the end of its scaling life. Samsung has announced that they will switch to Horizontal Nanosheets (HNS) at 3nm. TSMC will maintain 3nm FF but is expected to transition to a new architecture at 2nm.
2020-09-16
17
2020-02
IEDM: New interconnection technology beyond 3nm
In a short course on a Sunday during the last IEDM, Chris Wilson from imec presented new interconnect technologies suitable for nodes below 3nm.
2020-02-17
Focus on the research and development and industrialization of new electronic material precursors, and become the leader of localization of advanced electronic materials.
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